Part Number : LP8755
Function : Multi-Phase 6-Core Step-Down Converter
Package : 49-Bump 0.4 mm Pitch DSBGA Type
Maker : Texas Instruments
Pinouts : 
Description :
The LP8755 is designed to meet the power management requirements of the latest applications processors in mobile phones and similar portable applications. The device contains six step-down DC/DC converter cores, which are bundled together in a 6-phase buck converter. The device is fully controlled by a SmartReflex™-compatible interface or an I2C-compatible serial interface.
Features
1. Four Pin-Selectable I2C Addresses
2. Output Short-Circuit and Input Over-voltage Protection
3. Spread Spectrum for EMI Reduction
4. Over-Temperature Protection (OTP)
Datasheet PDF Download : 
Others datasheet of same file :
LP8755KME, LP8755KME/NOPB, LP8755KMX, LP8755KMX/NOPB
