DescriptionPartnumber : RJP30H2A Features 1. Trench gate and thin wafer technology (G6H-II series) 2. Low collector to emitter saturation voltage: VCE(sat) = 1.4 V typ 3. High speed switching: tf = 100 ns typ, tf = 180 ns typ 4. Low leak current: ICES = 1 µA max 1. Type of IGBT Channel : N-Channel 2. Maximum Power Dissipation (Pc), W: 60 3. Maximum Collector-Emitter Voltage |Vce|, V: 360 4. Collector-Emitter saturation Voltage |Vcesat|, V: 1.9 5. Maximum Gate-Emitter Voltage |Veg|, V: 30 6. Maximum Collector Current |Ic|, A: 35 7. Maximum Junction Temperature (Tj), °C: 150 8. Maximum Collector Capacity (Cc), pF: 60 |
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