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Description

1. Planar Die construction

2. 500mW Power Dissipation

3. Ideally Suited for Automated Assembly Processes

4. Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA

• Case: Molded Glass MINI-MELF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Polarity: See Diagram Below

• Approx. Weight: 0.03 grams

• Mounting Position: Any

• Packing information