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Description

1. For surface mounted applications in order to optimize board space.

2. Low profile package

3. Built-in strain relief

4. Glass passivated junction

5. Low inductance

6. High temperature soldering : 260 C /10 seconds at terminals

7. Plastic package has Underwriters Laboratory Flammability Classification 94V-O

MECHANICAL DATA

1. Case: JEDEC DO-214AA,Molded plastic over passivated junction.

2. Terminals: Solder plated,solderable per MIL-STD-750, Method 2026

3. Polarity: Color band denotes positive end (cathode)

4. Standard Packaging:12mm tape (EIA-481)

5. Weight: 0.003 ounce, 0.093 gram