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Description

• Glass passivated chip junction

• Available in uni-directional only

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Solder dip 275 °C max. 10 s, per JESD 22-B106

Applications : 

Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, and telecommunication.

MECHANICAL DATA

1. Case : DO-41 (DO-204L), molded epoxy over passivated chip

2. Molding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant and commercial grade