• Glass passivated chip junction • Low forward voltage drop • Low leakage current, typical IRless than 0.1 μA • High forward surge capability • Meets environmental standard MIL-S-19500 • Solder dip 275 °C max. 10 s, per JESD 22-B106
Mechanical Data
1. Case: JEDEC DO-204AC, molded plastic over glass passivated chip
2. Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026